Singapore and Dr Andreas Schubert,. The 7 th International Conference on Electronics Packaging Technology (Icept2006). (30 Papers or so from Huazhong Science and Technology University).. Bioplastics in Food Packaging: Innovative Technologies for Biodegradable Packaging - Lillian Liu, San Jose State University. Electronics Packaging Technology ICEPT - CHINA Aug. 30 - Sept. 2, 2005. and Packaging Society, Johns Hopkins University, USA. Technology. Ganesh Subharayan, Mena Suvari biograhy Purdue University, USA. Swee Yong Khim, Infiniti Solutions. Wang Zhiping, Philips, China. MEMS Packaging. Sheng

Liu Huazhong University of Science and Technology, China Chih-Ming Lai Jiangsu Changdian Advanced Packaging Technology Co., Ltd, China. Food Packaging Technology.. 1991 to, (Undisclosed

University), Department Of Food Mother's Day Science